Fabrication and Properties of Sn-3.5Ag-XCu Solder by Ball Milling and Paste Mixing

Abstract:

The present work is focused on the preparation and the properties of Sn-Ag-nanoCu composite solder by two methods, i.e. ball milling and paste mixing. Copper nanoparticles were added at two different compositions, 0.7% and 3%, to Sn-3.5Ag solder powder and paste by ball milling and paste mixing, respectively. The composite solder was deposited on the Cu substrate and heated at 250°C for 60 seconds and allowed to cool at room temperature. The wetting ability was evaluated with the wetting angle of deposited composite solder on Cu substrate. The microstructure, morphology and hardness were examined for composite solder joints. It was found that the lowest melting point was achieved at 213.6°C for Sn-3.5Ag-3nanoCu produced by ball milling. The wetting angle deterioted as Cu nanoparticles were added into the Sn-3.5Ag solder paste by paste mixing. However, when Cu nanoparticles were added by 0.7% and 3.0% by ball milling, the wetting angle improved by 5% and 37%, respectively. The hardness of composite solder improved up to 32% when 3% Cu was added by ball milling.

• Periodical: Defect and Diffusion Forum (Volumes 326-328)
• Pages: 12-17
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.326-328.12
• Online since: April 2012
• Authors: Aemi Nadia, A.S.M. Abdul Haseeb
• Keywords: Ball Mill, Nanocomposite, Paste Mix, Sn3.5Ag Solder

References

[1] K. Zeng, and K. N . Tu: Material Science and Engineering Vol. 38 (2002), p.55.

[2] K. N. Tu , A. M. Gusak and M. Li: Journal of Applied Physics Vol. 93 (2003), p.1335.

[3] F. Guo, J.P. Lucas, K.N. and Subramanian: Journal of Materials Science-Materials in Electronics Vol. 12 (2001) , p.27.

[4] Fu Guo: Journal Material Science-Mater Electron Vol. 18 (2007), p.129.

[5] J. Shen and Y.C. Chan: Microelectronics Reliability Vol. 49 (2009), p.223.

[6] S. -T. Kao, Y.C. Lin and J.G. Duh: Journal of Electronics Materials Vol. 35 (2006), p.486.

[7] S.T. Kao and J.G. Duh: Journal of Electronics Materials, Vol. 33(2004), p.1445.

[8] S.T. Kao and J.G. Duh: Journal of Electronics Materials, Vol. 33(2004), p.1445.

[9] H.L. Lai and D. H Guh: Journal of Electronics Materials Vol. 32 (2003), p.215.

[10] D.C. Lin, T.S. Srivatsan, G-X. Wang, and R. Kovacevic: Journal of Materials Engineering and Performance Vol. 16 (2007), p.647.

[11] P. Yao, P. Liu , J. Liu: Journal of Alloys and Compounds Vol. 462 (2008), p.73.

[12] J.M. Song, C.F. Huang and H.Y. Chuang: Journal of Electronic Materials Vol. 35 (2006), p.2154.

[13] B. Reddy , P. Bhattacharya, B. Singh, K. Chattopadhyay: J Mater Sci, Vol. 44 (2009) , p.2257.

[14] H. Ehrhardt, J. Weissmuller, G. Wilde: Mater Res Soc Symp Proc B8. 6. 1 (2001), p.634.

[15] C.Y. Liu, Jian Li, G.J. Vandentop, W.J. Choi and K.N. Tu: Journal of Electronic Materials Vol. 30 (2001), p.521.

[16] C.M.L. Wu, D.Q. Yua, C.M.T. Law, and L. Wang: Materials Science and Engineering Vol. 44 (2004), p.1.

[17] G. Maveety, O. Liu, J. Vijayen, F. Hua and E.A. Sanchez: Journal of Electronic Materials. Vol. 33 (2004), p.1355.

[18] J.M. Song, C.F. Huang and H.Y. Chuang : Journal of Electronic Materials Vol. 35 (2006) , p.2154.

[19] V. Sivabubramaniam, N.S. Bosco, J. Janczak Rusch, J. Cugnoni and J. Botsis: Journal of Electronic Materials Vol. 37 (2008), p.1598.