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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 95-98Diffusion of Copper, Iron and Silicon in Ni3Al

Diffusion of Copper, Iron and Silicon in Ni₃Al

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Diffusion in Materials - DIMAT 1992

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Periodical:

Defect and Diffusion Forum (Volumes 95-98)

Pages:

859-864

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.95-98.859

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Online since:

January 1993

Authors:

Seung Boo Jung, Yoritoshi Minamino, Hideki Araki, Toshimi Yamane, Kiyoshi Hirao, S. Saji

Keywords:

Interdiffusion, Intermetallic, Ni₃Al, Volume Diffusion

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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