Diffusion of Copper, Iron and Silicon in Ni3Al

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Periodical:

Defect and Diffusion Forum (Volumes 95-98)

Edited by:

M. Koiwa, K. Hirano, H. Nakajima and T. Okada

Pages:

859-864

Citation:

S. B. Jung et al., "Diffusion of Copper, Iron and Silicon in Ni3Al", Defect and Diffusion Forum, Vols. 95-98, pp. 859-864, 1993

Online since:

January 1993

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Price:

$38.00

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