The Characterization of Electroless Ni Bump for the Flip Chip

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Edited by:

Jung-Ho Ahn and Yoo-Dong Hahn

Pages:

439-444

DOI:

10.4028/www.scientific.net/JMNM.15-16.439

Citation:

C. Y. Lee et al., "The Characterization of Electroless Ni Bump for the Flip Chip", Journal of Metastable and Nanocrystalline Materials, Vols. 15-16, pp. 439-444, 2003

Online since:

April 2003

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$35.00

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