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HomeJournal of Metastable and Nanocrystalline...Journal of Metastable and Nanocrystalline...The Characterization of Electroless Ni Bump for...

The Characterization of Electroless Ni Bump for the Flip Chip

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Metastable, Mechanically Alloyed and Nanocrystalline Materials 2002

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Periodical:

Journal of Metastable and Nanocrystalline Materials (Volumes 15-16)

Pages:

439-444

DOI:

https://doi.org/10.4028/www.scientific.net/JMNM.15-16.439

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Online since:

April 2003

Authors:

Chang Youl Lee, Chang Bae Lee, Seung Boo Jung, Chang-Chae Shur

Keywords:

Electroless Ni Bump, Flip Chip, UBM, Zincating

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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