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HomeKey Engineering MaterialsKey Engineering Materials Vol. 103Dislocation Microstructure and Residual Long-Range...

Dislocation Microstructure and Residual Long-Range Internal Stresses in Wire-Drawn Cu Single Crystals

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Periodical:

Key Engineering Materials (Volume 103)

Pages:

211-216

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.103.211

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Online since:

May 1995

Authors:

A. Borbély, G. Hoffmann, Tamás Ungár

Keywords:

Dislocation Density, Long-Range Internal Stresses, Wire-Drawing, X-Ray Line Profile

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© 1995 Trans Tech Publications Ltd. All Rights Reserved

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