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HomeKey Engineering MaterialsKey Engineering Materials Vols. 122-124Ceramic Packaging for Electronics

Ceramic Packaging for Electronics

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Abstract:

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Advanced Ceramic Materials

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Periodical:

Key Engineering Materials (Volumes 122-124)

Pages:

17-34

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.122-124.17

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Online since:

September 1996

Authors:

R. Roy

Keywords:

Ceramic, Electronics, Hybrid, Multilayer Packages, Packaging, Power Packages, Thick Film Hybirds

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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