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HomeKey Engineering MaterialsKey Engineering Materials Vols. 161-163Profiled Ceramic Micropackages for Microwave...

Profiled Ceramic Micropackages for Microwave Application

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Abstract:

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The Science of Engineering Ceramics II

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Periodical:

Key Engineering Materials (Volumes 161-163)

Pages:

687-0

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.161-163.687

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Online since:

July 1998

Authors:

Cornel Anton, Marcela Muntean, A. Muller, Virginia Burghelea, Dorel Radu, S. Iordanescu

Keywords:

Microwave Package, Tuning-Varactor

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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