Creep Behavior and Modeling of SiC-Based PC Ceramic Matrix Composites with Glass Sealant in High Temperature Air

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Periodical:

Key Engineering Materials (Volumes 164-165)

Edited by:

K. Niihara, K. Nakano, T. Sekino, E. Yasuda

Pages:

197-200

DOI:

10.4028/www.scientific.net/KEM.164-165.197

Citation:

T. Ishikawa et al., "Creep Behavior and Modeling of SiC-Based PC Ceramic Matrix Composites with Glass Sealant in High Temperature Air", Key Engineering Materials, Vols. 164-165, pp. 197-200, 1999

Online since:

July 1998

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Price:

$35.00

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