Creep Behaviour at High Temperatures of Fine SiC and Alumina Based Fibres

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Periodical:

Edited by:

E. Yasuda, F. Wakai, L.M. Manocha, Y. Tanabe

Pages:

57-64

DOI:

10.4028/www.scientific.net/KEM.166.57

Citation:

M. H. Berger and A.R. Bunsell, "Creep Behaviour at High Temperatures of Fine SiC and Alumina Based Fibres", Key Engineering Materials, Vol. 166, pp. 57-64, 1999

Online since:

April 1999

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$35.00

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