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HomeKey Engineering MaterialsKey Engineering Materials Vol. 166Tensile Creep Degradation in Quasi-Ductile Silicon...

Tensile Creep Degradation in Quasi-Ductile Silicon Nitride

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Periodical:

Key Engineering Materials (Volume 166)

Pages:

95-102

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.166.95

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Online since:

April 1999

Authors:

František Lofaj, Atsushi Okada, Hiroshi Kawamoto

Keywords:

Cavitation, Oxidation, Tensile Creep, Young's Modulus

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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