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HomeKey Engineering MaterialsKey Engineering Materials Vols. 183-187Strength and Fracture of Cu-Based Filamentary...

Strength and Fracture of Cu-Based Filamentary Nanocomposites

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Fracture and Strength of Solids IV

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Periodical:

Key Engineering Materials (Volumes 183-187)

Pages:

1207-1212

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.183-187.1207

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Online since:

April 2000

Authors:

Sun Ig Hong, J.H. Chung, Hyoung Seop Kim

Keywords:

Barrier Strengthening, Cu-Nb, Filament, Grain Boundary, Nanocomposite, Strength, Substructure Strengthening

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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