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HomeKey Engineering MaterialsKey Engineering Materials Vols. 202-203Research on CMP Process Parameters Effect on...

Research on CMP Process Parameters Effect on Slurry Transport

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Abstract:

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Advances in Abrasive Processes

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Periodical:

Key Engineering Materials (Volumes 202-203)

Pages:

281-284

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.202-203.281

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Online since:

June 2001

Authors:

Z.W. Shen, Ju Long Yuan, Bin Lin, Jia Jin Zheng, Jian Ruan, L.B. Zhang

Keywords:

Polishing Parameters, Slurry Distribution, Slurry Transport

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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