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HomeKey Engineering MaterialsKey Engineering Materials Vols. 230-232New Adhesion Process Based on Lead-Free Solder...

New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices

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Advanced Materials Forum I

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Periodical:

Key Engineering Materials (Volumes 230-232)

Pages:

92-95

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.230-232.92

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Online since:

October 2002

Authors:

H. Seiroco, M. Vincente, J. Ferreira, Francisco Manuel Braz Fernandes, A.P. Marvão, J.I. Martins, Elvira Fortunato, Rodrigo Martins

Keywords:

Bonding, Intermetallic, Joins, Soldering

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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Citation:

[1] Jutta Müller, Hansjörg Griese, Herbert Reichl: IPCWorks’99 in Minneapolis, October 26 – 28, 1999, International Summit on Lead-Free Electronic Assemblies.

[2] C. Gonçalves and J. Ferreira, E. Fortunato, I. Ferreira, R. Martins, A.P. Marvão, J. I. Martins, T. Harder and R. Oppelt: Sensors & Actuators, A 74 (1999) 70.

DOI: 10.1016/s0924-4247(98)00305-7

[3] J. Ferreira, H. Seiroco, F. Braz Fernandes, R. Martins, E. Fortunato, A. P. Marvão, J.I. Martins. Applied Surface Science, 168 (2000) pp.292-295.

DOI: 10.1016/s0169-4332(00)00627-9