New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices

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Periodical:

Key Engineering Materials (Volumes 230-232)

Edited by:

Teresa Vieira

Pages:

92-95

DOI:

10.4028/www.scientific.net/KEM.230-232.92

Citation:

H. Seiroco et al., "New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices", Key Engineering Materials, Vols. 230-232, pp. 92-95, 2002

Online since:

October 2002

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$35.00

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