New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices

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Periodical:

Key Engineering Materials (Volumes 230-232)

Edited by:

Teresa Vieira

Pages:

92-95

Citation:

H. Seiroco et al., "New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices", Key Engineering Materials, Vols. 230-232, pp. 92-95, 2002

Online since:

October 2002

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[1] Jutta Müller, Hansjörg Griese, Herbert Reichl: IPCWorks’99 in Minneapolis, October 26 – 28, 1999, International Summit on Lead-Free Electronic Assemblies.

[2] C. Gonçalves and J. Ferreira, E. Fortunato, I. Ferreira, R. Martins, A.P. Marvão, J. I. Martins, T. Harder and R. Oppelt: Sensors & Actuators, A 74 (1999) 70.

DOI: https://doi.org/10.1016/s0924-4247(98)00305-7

[3] J. Ferreira, H. Seiroco, F. Braz Fernandes, R. Martins, E. Fortunato, A. P. Marvão, J.I. Martins. Applied Surface Science, 168 (2000) pp.292-295.

DOI: https://doi.org/10.1016/s0169-4332(00)00627-9