Viscoplastic Deformation of Lead-Free Solder Alloy - Experiments and Simulations

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Periodical:

Key Engineering Materials (Volumes 233-236)

Edited by:

L.C. Zhang and G. Lu

Pages:

779-784

DOI:

10.4028/www.scientific.net/KEM.233-236.779

Citation:

K. Sasaki et al., "Viscoplastic Deformation of Lead-Free Solder Alloy - Experiments and Simulations", Key Engineering Materials, Vols. 233-236, pp. 779-784, 2003

Online since:

January 2003

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$35.00

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