Effect of Bonding Condition on Microstructure and Properties of the Si3N4/Si3N4 Joint Brazed Using Cu-Zn-Ti Filler Alloy

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Periodical:

Edited by:

Lianmeng Zhang, Jingkun Guo and Wei-Hsing Tuan

Pages:

255-260

DOI:

10.4028/www.scientific.net/KEM.249.255

Citation:

J. Zhang et al., "Effect of Bonding Condition on Microstructure and Properties of the Si3N4/Si3N4 Joint Brazed Using Cu-Zn-Ti Filler Alloy ", Key Engineering Materials, Vol. 249, pp. 255-260, 2003

Online since:

September 2003

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$35.00

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