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HomeKey Engineering MaterialsKey Engineering Materials Vol. 249Fracture Behavior Simulation of 3D-C/SiC Under...

Fracture Behavior Simulation of 3D-C/SiC Under Stress and in Oxidation Environment

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Composite Materials III

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Periodical:

Key Engineering Materials (Volume 249)

Pages:

339-342

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.249.339

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Online since:

September 2003

Authors:

Q.F. Zeng, Lai Fei Cheng, Li Tong Zhang, Xin Gang Luan

Keywords:

3D-C/SiC, Fracture, Oxidation, Simulation, Stress

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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[8] X. Yin: PH.D thesis of Northwestern Polytechnic University, Xi'an, P.R.C, 1997, p.35. Fig. 8 Fracture Sections of C/SiC under different environments (a) stress level of 60±20MPa with the root at a temperature of 1085°C (b) unstressed sample in air and under 500°C for 10h (a) (b)