[1]
A. L. Rogach, N. A. Kotov, D. S. Koktysh, J. W. Ostrander, and G. A. Ragoisha, Chem. Mater., 12 (2000), p.2721.
Google Scholar
[2]
F. Richetti, J. Prost, and P. J. Barois, J. Phys. Lett., 45 (1984), p. L1137.
Google Scholar
[3]
P. J. Sides, Langmuir, 17 (2001), p.5791.
Google Scholar
[4]
M. Giersig and P. Mulvaney, Langmuir, 9 (1993), p.3408.
Google Scholar
[5]
M. Böhmer, Langmuir, 12 (1996), p.5747.
Google Scholar
[6]
M. Trau, D. A. Saville, and I. A. Aksay, Science, 272 (1996), p.706.
Google Scholar
[7]
R. C. Hayward, D. A. Saville, and I. A. Aksay, Nature, 404 (2000), p.56.
Google Scholar
[8]
P. Sarker and P. S. Nicholson, J. Am. Ceram. Soc., 79 (1996), p. (1987).
Google Scholar
[9]
P. Sarkar, D. De, K. Yamashita, P.S. Nicholson and T. Umegaki, J. Am. Ceram. Soc., 83 (2000), p.1399.
Google Scholar
[10]
J. Hamagami, K. Hasegawa and K. Kanamura, Development of Particle Assembling Technology by Using Micro-Electrophoretic Deposition Process, CSJ Series-Publications of the Ceramic Society of Japan, Vol. 11, Electroveramics in Japan VI, Edited by T. Kimura, T. Takenaka, S. Fujitsu and K. Shinozaki, (Trans Tech Publications Ltd., Switzerland, 2003), pp.195-198.
DOI: 10.4028/www.scientific.net/kem.248.195
Google Scholar