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HomeKey Engineering MaterialsKey Engineering Materials Vols. 270-273Application of Micro-ESPI Technique for...

Application of Micro-ESPI Technique for Measurement of Micro-Tensile Properties

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Periodical:

Key Engineering Materials (Volumes 270-273)

Pages:

744-749

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.270-273.744

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Online since:

August 2004

Authors:

Yong Hak Huh, Dong Iel Kim, Dong Jin Kim, Philip Park, Chang Doo Kee, Jun Hyub Park

Keywords:

Copper Foil, Elastic Modulus, Micro-ESPI, Stress-Strain Curve, Tensile Strength, Yielding Strength

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] Mohamed Gad-el-Hak: The MEMS Handbook (CRC Press, 2002).

[2] J.H., Park: IEEE Trans. On Components and Packaging Technologies, Vol. 25 (2002), p.1.

[3] W.N., Sharper, Jr., B. Yuan, and R.L., Edwards: J. microelectromechnical systems, Vol. 6 No. 3 (1997), p.193.

[4] D.T., Read: Mesaurement Science and Technology, Vol. 9 (1998), p.676.

[5] H.D. Espinosa, and B.C. Prorok, M. Fisher: Proc. of the SEM Annual Conf. (2001), p.446.

[17] 7 ± 2. 7.

[2] 41 ± 2. 6 461. 2 ± 14. 9 397. 1 ± 5. 6.

[79] 9 ± 1. 41.

74 ± 2. 5.

[1] 38 ± 0. 7 365. 0 ± 3. 3 305. 8 ± 4. 2.

[70] 8 ± 5. 0.

[21] 1 ± 2.

46 ± 0. 2 377. 3 ± 11. 8 305. 9 ± 5. 7.

[72] 3 ± 0. 8.

[18] 97 ± 4. 8.

[1] 56 ± 0. 4 294. 6 ± 1. 6 257. 6 ± 7. 4.

[71] 1 ± 5. 3 F2WS FQVLP FQHTE HTE I.D. of Material Plastic Exponent m Plastic Constant α0(x10 -3 ) Tensile Strength σul(Mpa) Yielding Strength σys (MPa) Elacitic Modulus E (GPa) Table 1. Summary of mechanical properties for 4 kinds of electrolytic copper foils.