p.28
p.34
p.40
p.47
p.53
p.59
p.66
p.72
p.78
Measurement of Continuous Micro-Tensile Strain Using Micro-ESPI Technique
Abstract:
To determine the micro-mechanical properties for micro/nano materials, it may be essential to measure the strain/deformation during micro-mechanical testing. Therefore, in this study, continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and 0.47µm thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens by the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile loading. Micro-tensile stress-strain curves for these materials were determined using the algorithm for continuous strain measurement. Furthermore, the new algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. Using the algorithm, micro-tensile strain data between interfringes were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.
Info:
Periodical:
Pages:
53-58
Citation:
Online since:
November 2005
Authors:
Price:
Сopyright:
© 2005 Trans Tech Publications Ltd. All Rights Reserved
Share:
Citation: