Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder

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The low-cycle fatigue behavior on Sn-0.7Cu lead-free solder as-cast and Sn-Pb eutectic solder as-cast were investigated at a strain rate 0.1%/s under various temperatures of 25, 80 and 120oC. In addition, the relationships between the surface feature in the low-cycle fatigue test and low-cycle fatigue life of those solders at 25oC were investigated by image processing. The low-cycle fatigue life of Sn-0.7Cu decreased when the temperature increased. And the fatigue life of Sn-0.7Cu was better than that of the Sn-Pb eutectic solder at the temperatures of 25 and 80oC. The low-cycle fatigue behavior on the solders investigated followed Coffin-Manson equation. The fatigue ductility coefficient of Sn-0.7Cu was found to be affected by the temperature. The surface deformation as fine meshes in the low-cycle fatigue test of Sn-0.7Cu did not appear until 10% of the fatigue life. Although it was over 10% of the fatigue life, the surface deformation that was caused by micro cracks and coalesces occurred with the increasing number of cycles. The relationships between the surface feature in the low-cycle fatigue test and the low-cycle fatigue life on Sn-0.7Cu and Sn-37Pb solders were discussed.

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Periodical:

Key Engineering Materials (Volumes 306-308)

Edited by:

Ichsan Setya Putra and Djoko Suharto

Pages:

115-120

Citation:

T. Takahashi et al., "Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder", Key Engineering Materials, Vols. 306-308, pp. 115-120, 2006

Online since:

March 2006

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$38.00

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