Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding

Abstract:

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The cohesive zone interface model was used to calculate 90o peel in the ACF bonding samples. The constitutive equation for the interface model was modified by introduction a damage factor χ . The thermal damage factor and humidity damage factor can be derived from the experiment data. The interfacial model with damage factor can change the maximal peel stress and the delamination length. The calculation result of the interfacial model with damage factor agreed well to the experiment of the 90o peeling.

Info:

Periodical:

Key Engineering Materials (Volumes 324-325)

Edited by:

M.H. Aliabadi, Qingfen Li, Li Li and F.-G. Buchholz

Pages:

471-474

DOI:

10.4028/www.scientific.net/KEM.324-325.471

Citation:

J. Zhang, X. Chen, X. L. Wei, "Numerical Calculation of Peeling Strength in Anisotropic Conducive Adhesive Bonding ", Key Engineering Materials, Vols. 324-325, pp. 471-474, 2006

Online since:

November 2006

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Price:

$35.00

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