A Micro Ultrasonic Grinding Device with Very High Frequency and its Application

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Edited by:

Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki

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45-50

Citation:

K. Suzuki et al., "A Micro Ultrasonic Grinding Device with Very High Frequency and its Application", Key Engineering Materials, Vol. 329, pp. 45-50, 2007

Online since:

January 2007

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[1] T. Doutsu, et. al., Microscopic drilling of alumina ceramics by 60 kHz high frequency vibration machining (in Japanese), ABTEC'96, pp.252-253, (1996).

[2] S. Mishiro, et. al., Polishing characteristics of ultrasonic hand-lapper installing complex vibration transducer (in Japanese), JSPE Autumn Conf., pp.221-222, (1991).

[3] T. Uematsu, et. al., Grinding of ceramics on a machining center type grinding center (in Japanese), JSPE Autumn Conf., pp.265-266, (1985).