A Micro Ultrasonic Grinding Device with Very High Frequency and its Application

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Periodical:

Edited by:

Dongming Guo, Tsunemoto Kuriyagawa, Jun Wang and Jun’ichi Tamaki

Pages:

45-50

DOI:

10.4028/www.scientific.net/KEM.329.45

Citation:

K. Suzuki et al., "A Micro Ultrasonic Grinding Device with Very High Frequency and its Application", Key Engineering Materials, Vol. 329, pp. 45-50, 2007

Online since:

January 2007

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$35.00

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