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HomeKey Engineering MaterialsKey Engineering Materials Vol. 329A Micro Ultrasonic Grinding Device with Very High...

A Micro Ultrasonic Grinding Device with Very High Frequency and its Application

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Advances in Abrasive Technology IX

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Periodical:

Key Engineering Materials (Volume 329)

Pages:

45-50

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.329.45

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Online since:

January 2007

Authors:

Kiyoshi Suzuki, Shoji Mishiro, Yoshiaki Shishido, Manabu Iwai, Wang Mei, Tetsutaro Uematsu

Keywords:

Magnetostrictive Type Transducer, Micro Depth of Cut, Ultrasonic Grinding, Very High Frequency Ultrasonic Transducer

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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[1] T.Doutsu, et. al., Microscopic drilling of alumina ceramics by 60 kHz high frequency vibration machining (in Japanese), ABTEC'96, pp.252-253, (1996)

[2] S.Mishiro, et. al., Polishing characteristics of ultrasonic hand-lapper installing complex vibration transducer (in Japanese), JSPE Autumn Conf., pp.221-222, (1991)

[3] T.Uematsu, et. al., Grinding of ceramics on a machining center type grinding center (in Japanese), JSPE Autumn Conf., pp.265-266, (1985) Fig.10 Sub-micron steps formed on ground surface made by regulating longitudinal amplitude (Complex mode, VS=24m/min, VW=29.8mm/min, Silicon, Wet) Diamond wheel (φ1.5, SD170M) Workpiece