Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process

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Periodical:

Key Engineering Materials (Volumes 334-335)

Edited by:

J.K. Kim, D.Z. Wo, L.M. Zhou, H.T. Huang, K.T. Lau and M. Wang

Pages:

385-388

Citation:

Y. T. Park and T. M. Kang, "Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process", Key Engineering Materials, Vols. 334-335, pp. 385-388, 2007

Online since:

March 2007

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