Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process

Yong Tae Park; Tae Min Kang

doi:10.4028/www.scientific.net/KEM.334-335.385

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Improvement of Mechanical Properties of Curaua Fiber Green Composites
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Local Buckling Coefficient of Thin-Walled Pultruded FRP Compression Members
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Perforated FRP Shear Connector for the FRP-Concrete Composite Bridge Deck
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Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process
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Characterization of “Green” Composites Reinforced by Cellulose Nanofibers
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Finite Element Analysis of Wave Transmission through a Unidirectional Composite Layer
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Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process

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Periodical:

Key Engineering Materials (Volumes 334-335)

Pages:

385-388

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.334-335.385

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Online since:

March 2007

Authors:

Yong Tae Park, Tae Min Kang

Keywords:

Design of Experiment (DOE), FBGA, Optimization, Packaging, Warpage

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