Preparation of Functionally Graded Cu/AlN/Cu Electrode Materials for Thermoelectric Devices

Abstract:

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The Cu/AlN/Cu functionally graded materials (FGMs) were successfully fabricated using the spark plasma sintering (SPS) method, and a two-step process was used. First, a symmetrical porositygraded AlN plate was prepared using AlN powder consisting of particles of varying sizes. Afterwards, graded Cu/AlN/Cu samples were made by introducing Cu into the pores of the external, porous AlN layer.

Info:

Periodical:

Key Engineering Materials (Volumes 336-338)

Edited by:

Wei Pan and Jianghong Gong

Pages:

2613-2615

DOI:

10.4028/www.scientific.net/KEM.336-338.2613

Citation:

H. Q. Zhang and J. F. Li, "Preparation of Functionally Graded Cu/AlN/Cu Electrode Materials for Thermoelectric Devices", Key Engineering Materials, Vols. 336-338, pp. 2613-2615, 2007

Online since:

April 2007

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Price:

$35.00

[1] K.A. Khor, K.H. Cheng, L.G. Yu and F. Boey: Mater. Sci. Eng. A Vol. 347 (2003), p.300.

[2] A. Ohtsuka, A. Kawasaki, R. Watanabe, et al.: J. Jpn. Soc. Powder Metall. Vol. 45 (1998), p.220.

[3] K. Kikuchi, Y.S. Kang and A. Kawasaki: J. Jpn. Soc. Powder Metall. Vol. 47 (2000), p.347.

[4] S. Z. Jin, H. L. Zhang, S. S. Jia, J. -F. Li, Key Eng. Mater. Vol. 280-283 (2005), p.1881.

[5] S. Z. Jin, H. L. Zhang, S. S. Jia, J. -F. Li, Mater. Sci. Forum Vol. 475-479 (2005), p.1555.

[6] U. Anselmi-Tamburini, S. Gennari, J. E. Garay, et al.: Mater. Sci. Eng. A Vol. 394 (2005), p.139. Fig. 7 photograph of real Cu/AlN/Cu FGMs.

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