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HomeKey Engineering MaterialsKey Engineering Materials Vols. 340-341Ratchetting and Creep Deformation of Solder Alloys

Ratchetting and Creep Deformation of Solder Alloys

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Periodical:

Key Engineering Materials (Volumes 340-341)

Pages:

859-864

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.340-341.859

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Online since:

June 2007

Authors:

Takuji Kobayashi, Katsuhiko Sasakir, Ken-Ichi Ohguchi, Yoshihiro Narita

Keywords:

Constitutive Modeling, Creep, Dislocation, Electronic Packaging, Lead-Free Solder Alloy, Plasticity, Ratcheting

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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