Computer Study of Skeletal Settling Combined with Extrication of Solid Phase Domains during Liquid Phase Sintering of Tungsten Heavy Alloy

Zoran S. Nikolic; Masahiro Yoshimura

doi:10.4028/www.scientific.net/KEM.352.9

Paper Titles

Rate Equations for Material Transport Driven by Excess Free Energy in Solid
p.1

Monte Carlo Simulation of Porous Layers Sintering
p.5

Computer Study of Skeletal Settling Combined with Extrication of Solid Phase Domains during Liquid Phase Sintering of Tungsten Heavy Alloy
p.9

Two-Dimensional Heat Transfer Model for Rapid Solidification of Ceramic Alloys
p.13

The Role of Strength, Fracture Cause, and Fracture Location Data on the Reliability Analysis of Ceramics
p.17

Theoretical Tensile Deformation of Σ13 Pyramidal Twin Grain Boundary in Alumina
p.21

Step Free Energy Change and Microstructural Development in BaTiO₃-SiO₂
p.25

Evaluation of Damage for Alumina/Graphite Refractory Using Apparent Sonic Velocity Measurement
p.31

Effect of Heat-Treatment on Thermal and Mechanical Properties of Silicon Nitride Ceramic at Room and High Temperatures
p.35

HomeKey Engineering MaterialsKey Engineering Materials Vol. 352Computer Study of Skeletal Settling Combined with...

Computer Study of Skeletal Settling Combined with Extrication of Solid Phase Domains during Liquid Phase Sintering of Tungsten Heavy Alloy

Abstract:

In this paper, we investigated numerically gravity induced skeletal settling during liquid phase sintering. The microstructural evolution will be simulated by simultaneous computation of displacement of the center of mass and mass transport due to dissolution and precipitation at the interfaces between solid-phase and liquid matrix. Common to this study based on domain methodology for definition of regular multi-domain model will be the need to relate some diffusional phenomena to essential geometric and topological attributes of the W-Ni porous microstructure influenced by skeletal settling combined with extrication of some solid-phase domains during liquid phase sintering.