Joining TiB2-Ni Cermets with Ti6Al4V by Pulse Current Heating

Yong  Peng; Zheng Yi Fu; Wei Min Wang; H. Wang; Yu Cheng Wang; Jin Yong Zhang; Qing Jie Zhang

doi:10.4028/www.scientific.net/KEM.368-372.1609

Paper Titles

Structure Design for the Joining of Ceramics and Metal
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Joining of SiC Ceramic to Graphite Using Ni-51Cr Powders as Filler
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Expansion Coefficient of Sealing Material for Ceramic Metal Halide Lamps
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Phase Structure and Microstructure of the Interface between WC Steel Bond Hard Alloy and Carbon Steel
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Joining TiB₂-Ni Cermets with Ti6Al4V by Pulse Current Heating
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Microwave Joining of 95Al₂O₃ Using Interlayer Containing SiC
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Interface Microstructure of TiC Cermets/Steel Explosive Cladding Plate
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On the Interface between Porcelain and Titanium
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Wettability of Graphite/Ni plus Cr System
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 368-372Joining TiB2-Ni Cermets with Ti6Al4V by Pulse...

Joining TiB₂-Ni Cermets with Ti6Al4V by Pulse Current Heating

Abstract:

Pulse current heating technology is used to join TiB2-Ni cermets with Ti6Al4V at different temperatures (1023K, 1073K and 1123K) with 7MPa pressure and Cu foil and Ni foil are used as joining interlayer. Joint points increase with welding temperature. The microstructure of joints is observed through SEM images and micrographs. The diffusion coefficient (D0) of Cu at the Cu/TiB2 interface is calculated by the EPMA patterns. The diffusion principle of pulse current heating and influences of electric field and current on atom diffusion are studied.