Influence of Substrate Temperature on Microcracks Formation in Plasma-Sprayed Yttria-Stabilized Zirconia Splats

Ya Zhe Xing; Yong Li; Chang Jiu Li; Cheng Xin Li; Guan Jun Yang

doi:10.4028/www.scientific.net/KEM.373-374.69

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 373-374Influence of Substrate Temperature on Microcracks...

Influence of Substrate Temperature on Microcracks Formation in Plasma-Sprayed Yttria-Stabilized Zirconia Splats

Abstract:

YSZ molten droplets created by plasma spraying were deposited on the YSZ substrate preheated to different temperature from 75oC to 1000oC. The results showed that there is little change in crack spacing when substrate temperature is less than about 740oC, and a significant increase in crack spacing from 3.54 μm at 740oC to 10.91 μm at 1000oC was observed. A simple qualitative model was proposed on the basis of the origin of thermal stresses to explain the influence of substrate initial temperature on crack density characterized by crack spacing. The analysis indicates that the results can be ascribed to the changes in tensile stress and splat/substrate adhesion resulting from changes of substrate initial temperature.

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Key Engineering Materials (Volumes 373-374)

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69-72

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https://doi.org/10.4028/www.scientific.net/KEM.373-374.69

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Online since:

March 2008

Authors:

Ya Zhe Xing, Yong Li, Chang Jiu Li, Cheng Xin Li, Guan Jun Yang

Keywords:

Plasma Spraying, Substrate Temperature, Vertical Crack, Yttria Stabilized Zirconia (YSZ)

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