Specific Energies in Sawing with Diamond Segments and Grinding of a Diamond Segment

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An experimental study was undertaken to compare the mechanisms of two different processes to dress metal-bonded diamond segments. In one case, a piece of vitrified SiC wheel was used as workpiece and sawn by diamond segments attached to a sawblade. In another process, a diamond segment was used as workpiece and ground by an Al2O3 wheel. Spindle power was measured in sawing and horizontal force was monitored in grinding, in which case the latter was then used to get the consumed power in grinding. Specific energies were then calculated from the measured or converted power. For sawing of SiC wheel with the diamond sawblade, the maximum specific energy was found to be only 0.5 J/mm3, whereas the specific energy was up to 25 J/mm3 in the grinding of the diamond segment.

Info:

Periodical:

Key Engineering Materials (Volumes 375-376)

Edited by:

Yingxue Yao, Xipeng Xu and Dunwen Zuo

Pages:

375-379

DOI:

10.4028/www.scientific.net/KEM.375-376.375

Citation:

Y. Q. Yu et al., "Specific Energies in Sawing with Diamond Segments and Grinding of a Diamond Segment ", Key Engineering Materials, Vols. 375-376, pp. 375-379, 2008

Online since:

March 2008

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Price:

$35.00

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