Specific Energies in Sawing with Diamond Segments and Grinding of a Diamond Segment

Yi Qing Yu; Yuan Li; Xi Peng Xu

doi:10.4028/www.scientific.net/KEM.375-376.375

Paper Titles

Study on Integrated Method of Medical Implant Manufacture Based on Rapid Prototyping Technology
p.353

Study on Inner Micro-Grooves of Heat Pipe Spinning Process and Multi-Tooth Mandrel
p.358

Laser Surface Coating-Texturing of Cold Roll with Hard Dimples
p.364

Dynamic Characteristics Analysis of Diamond Saw Blade with Multi-Hole Base and Different Segment Width
p.369

Specific Energies in Sawing with Diamond Segments and Grinding of a Diamond Segment
p.375

Fundamental Study on Diamond Spherical Shell Film for Polishing of Concave Spherical Surface
p.380

Technique Project and Theoretic Research on Surface Finishing to the Wheel Hub
p.385

Experimental Research on Aluminum Alloy Blade’s Surface Roughness of Integrate Rotor Based on Four-Axis High Speed Milling
p.390

Research on Micro Characteristics of Surface and Subsurface Layer in Two-Dimensional Ultrasonic Grinding Nano-Composite Ceramics
p.395

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Specific Energies in Sawing with Diamond Segments and Grinding of a Diamond Segment

Abstract:

An experimental study was undertaken to compare the mechanisms of two different processes to dress metal-bonded diamond segments. In one case, a piece of vitrified SiC wheel was used as workpiece and sawn by diamond segments attached to a sawblade. In another process, a diamond segment was used as workpiece and ground by an Al2O3 wheel. Spindle power was measured in sawing and horizontal force was monitored in grinding, in which case the latter was then used to get the consumed power in grinding. Specific energies were then calculated from the measured or converted power. For sawing of SiC wheel with the diamond sawblade, the maximum specific energy was found to be only 0.5 J/mm3, whereas the specific energy was up to 25 J/mm3 in the grinding of the diamond segment.