The Analysis on the Stability of Diamond Wire Saw Cutting Process for the Silicon

Abstract:

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. In this paper, the model of fixed abrasive diamond wire saw has been set up, and its cutting mechanism has been discussed. Then, the material removal rate model and wire saw cutting efficiency model have been established. the speed of wire saw, the number of the dynamic effective abrasive and the workpiece feed rate have been analyzed to study their impaction on the stability of cutting process. Finally, some rules and suggestions were brought forward.

Info:

Periodical:

Key Engineering Materials (Volumes 407-408)

Edited by:

Fan Rui, Qiao Lihong, Chen Huawei, Ochi Akio, Usuki Hiroshi and Sekiya Katsuhiko

Pages:

684-689

DOI:

10.4028/www.scientific.net/KEM.407-408.684

Citation:

L. G. Zhao et al., "The Analysis on the Stability of Diamond Wire Saw Cutting Process for the Silicon ", Key Engineering Materials, Vols. 407-408, pp. 684-689, 2009

Online since:

February 2009

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Price:

$35.00

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