The Analysis on the Stability of Diamond Wire Saw Cutting Process for the Silicon

Li Gang Zhao; Dun Wen Zuo; Yu Li Sun; Min Wang

doi:10.4028/www.scientific.net/KEM.407-408.684

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 407-408The Analysis on the Stability of Diamond Wire Saw...

The Analysis on the Stability of Diamond Wire Saw Cutting Process for the Silicon

Abstract:

. In this paper, the model of fixed abrasive diamond wire saw has been set up, and its cutting mechanism has been discussed. Then, the material removal rate model and wire saw cutting efficiency model have been established. the speed of wire saw, the number of the dynamic effective abrasive and the workpiece feed rate have been analyzed to study their impaction on the stability of cutting process. Finally, some rules and suggestions were brought forward.

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Periodical:

Key Engineering Materials (Volumes 407-408)

Pages:

684-689

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.407-408.684

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Online since:

February 2009

Authors:

Li Gang Zhao, Dun Wen Zuo, Yu Li Sun, Min Wang

Keywords:

Diamond Wire Saw, Material Removal Rate (MRR), Silicon Wafer

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