Study on the Surface Integrity of Micro-Ultrasonic Machined Glass-Ceramic Material

Wei Haw Fan; Choung Lii Chao; Wen Chen Chou; Ta Tung Chen; Chung Woei Chao

doi:10.4028/www.scientific.net/KEM.407-408.731

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Study on the Surface Integrity of Micro-Ultrasonic Machined Glass-Ceramic Material
p.731

HomeKey Engineering MaterialsKey Engineering Materials Vols. 407-408Study on the Surface Integrity of Micro-Ultrasonic...

Study on the Surface Integrity of Micro-Ultrasonic Machined Glass-Ceramic Material

Abstract:

Ultrasonic machining (USM) technique has long been used for fabricating various patterns and drilling holes on brittle materials. However, the surfaces generated by USM are normally rather rough and covered by deep penetrated cracks. This has greatly limited USM being used in micro-machining and fine machining. This research aimed to study the surface integrity of the USMed surface and develop a feasible way to minimize the scattered cracks so that good surface finish could be achieved. Machining parameters such as type and concentration of abrasive particles, grit size, and feed rate were systematically investigated to check their influences on the surface obtained. A ‘multi-stage’ micro-USM process was developed in this study and surface with Ra value better than 0.2m was achieved using the proposed process.

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Periodical:

Key Engineering Materials (Volumes 407-408)

Pages:

731-734

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.407-408.731

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Online since:

February 2009

Authors:

Wei Haw Fan, Choung Lii Chao, Wen Chen Chou, Ta Tung Chen, Chung Woei Chao

Keywords:

Brittle Materials, Subsurface Damage, Ultrasonic Machining

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