The Deep Etching Process Based on Parallel Laser Direct Writing System

Jin Hu; D.L. Pu; Lin Sen Chen

doi:10.4028/www.scientific.net/KEM.426-427.265

Paper Titles

Effect of Input Power on the Deposition of Optical Grade Thick Diamond Film in a DCPJ CVD Jet System
p.245

Information Sharing in Construction Supply Chain
p.249

Research on Remote Intelligent Fault Diagnosis of CNC Machine Tools and Realization of its Software
p.254

Bubble Image Processing Algorithm and Application in Vacuum Casting Equipment
p.260

The Deep Etching Process Based on Parallel Laser Direct Writing System
p.265

Research on Concurrent Design and GM-Oriented System for Typical Mechanical Products
p.270

Microstructural Evolution of 7A04 Alloy Prepared by FE-ECAE in Semi-Solid State
p.274

Experimental Investigation on Green Cutting GH4169 with Ionized Air Cooling and Lubricating
p.279

Deformation Analysis of Thin-Walled Workpiece under Multi-Stress Coupled Effect
p.284

HomeKey Engineering MaterialsKey Engineering Materials Vols. 426-427The Deep Etching Process Based on Parallel Laser...

The Deep Etching Process Based on Parallel Laser Direct Writing System

Abstract:

Due to the high cost-effectiveness, extra flexibility, and short production cycle, laser direct writing system as a kind of maskless lithography technology has been widely used in the fields of micro-nano-manufacturing. The working principle of the parallel laser direct writing system based on DMD(Digital Micromirror Device) is introduced. A novel negative photoresist -- dry film photoresist is adopted into the study of deep etching for the fabrication of the micro mold. The experimental results show that: the whole process is convenient, efficient and flexible; the precision of the 2-D patterning and the depth of etching is reliable.

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Periodical:

Key Engineering Materials (Volumes 426-427)

Pages:

265-269

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.426-427.265

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Online since:

January 2010

Authors:

Jin Hu, D.L. Pu, Lin Sen Chen

Keywords:

Deep Lithography, Dry Film Photoresist, Maskless Lithography, Parallel Laser Direct Writing

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