Quasicontinuum Simulation of Effect of Crystal Orientation and Cutting Direction of on Nanometric Cutting of Single Crystal Copper

Hong Min Pen; Qing Shun Bai; Ying Chun Liang

doi:10.4028/www.scientific.net/KEM.431-432.154

Paper Titles

Simulation of Microstructure Evolution Coupled with Fabrication Pressure for Two-Phase Ceramic Tool Materials
p.138

FEM-Based Dynamic Performances of HSK Spindle/Toolholder Interface
p.142

Research on Simulating and Modeling Method for Spiral Bevel Gears with Actively Controllable Contact Patterns
p.146

Diamond Tool Wear Mechanism in Ultra-Precision Turning of SiC_p/Al Composites
p.150

Quasicontinuum Simulation of Effect of Crystal Orientation and Cutting Direction of on Nanometric Cutting of Single Crystal Copper
p.154

Study on Performance and Mechanism of High Efficiency Organic Grinding Liquid for Ceramics with Silicon
p.158

Study on the Cutting Force Modeling and Forecast Analysis in Machining Nickel Base Superalloy
p.162

Dynamic Collision Detection with Optimum Discrete Interval
p.166

Analysis and Study on Single Physics Field and Coupling Field of Cutting Tools for Machining Carbon Structural Steel
p.170

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Quasicontinuum Simulation of Effect of Crystal Orientation and Cutting Direction of on Nanometric Cutting of Single Crystal Copper

Abstract:

Quasicontinuum simulation of nanometric cutting was conducted on single crystal copper to investigate the effect of crystal orientation and cutting direction on nature of deformation of this material. The model reduces the degrees of freedom in simulations of nanometric cutting process without sacrificing important physics. The simulation results show the crystal orientation and cutting direction have a significant effect on the nature of deformation of nanometric cutting process. In addition, the variations of strain energy of workpiece atoms in different crystal set-ups are investigated.