Investigation of the Correlation between IC Chip Pick-Up Performance and Peeling Behavior of Adhesive Tapes

Abstract:

It was investigated that the influences of the peeling behavior of adhesive tapes in peeling tests on IC chip pick-up performance. Needles peel off an IC chip with an adhesive film from the base material in the pick-up process, by sticking out the backside of the base material. In the case that the peeling forces of the adhesive tape decrease as the peeling speeds increase in peeling tests, only two kinds of behaviors were observed in pick-up test; the peeling propagated little and the IC chip was not peeled off under critical needle displacement while the pick-up was completed instantaneously over critical needle displacement. In the case that the peeling forces of the adhesive tape increase as the peeling speeds increase, the pick-up time decreased as the needle displacement increased. As a result, it can be concluded that the needle displacement where the peeling propagates instantaneously is critical for succeeded pick-up if the peeling forces of the adhesive tape decrease as the peeling speeds increase. If the peeling forces of the adhesive tape increase as the peeling speeds increase, the information of peeling speeds at each needle displacement are needed to estimate how long it takes to pick-up a chip.

• Periodical: Key Engineering Materials (Volumes 462-463)
• Pages: 807-811
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.462-463.807
• Online since: January 2011
• Authors: Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, Hideo Seno, Kazuhiro Takahashi
• Keywords: Adhesive, Electronic Material, Interface, Peeling Test, Polymer Material

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