Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel

Shang Gao; Ren Ke Kang; Y. Li; Hang Gao

doi:10.4028/www.scientific.net/KEM.487.1

Paper Titles

Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel
p.1

Research on Micro-Grinding Method and Surface Quality
p.6

The Study of Wear Flat Effect on the Single Grain Micro-Cutting Performance in Superabrasive Grinding from a Simulation Perspective
p.11

Temperatures in Grinding Cemented Carbide (YT30) with a Vacuum Brazed Diamond Wheel
p.16

Investigation on the Workpiece Surface Residual Stress in High Efficiency Deep Grinding with Ultra High Wheel Speeds
p.24

Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold
p.29

Study on Grinding Machinability of Titanium Alloy Using SiC Abrasive
p.34

Removal Mechanism of Titanium Alloy Ti6Al4V Based on Single-Grain High Speed Grinding Test
p.39

HomeKey Engineering MaterialsKey Engineering Materials Vol. 487Surface and Subsurface Damages of CdZnTe...

Surface and Subsurface Damages of CdZnTe Substrates Ground by Diamond Grinding Wheel

Abstract:

Surface and subsurface damage affect the preparation of high-resolution HgCdTe and CdZnTe detectors. Grinding experiments were performed on CdZnTe substrates with the grinding wheels of different abrasive sizes. The surface topography and subsurface damages of CdZnTe substrates ground by diamond grinding wheels with different grit sizes were studied. The effects of the grit sizes of grinding wheels on the surface topography and subsurface damage of CdZnTe substrates were discussed. The surface roughness and subsurface damage layer depth of CdZnTe after grinding with #3000 diamond grinding wheel are only Ra 7 nm and 100 nm, proved that grinding is of great potential for CdZnTe substrate processing.