Development of a New Magnetic-Electrochemical Compound Polishing Tool

Article Preview

Abstract:

Added a magnetic field whose direction is parallel to the electrical field’s directions, the charged particles between two electrodes can move in spirals in magnetic-electrochemical compound polishing, and then the condition of chemical reaction is improved. The efficiency and quality of polishing can be promoted consequently. If the direction of magnetic field is changed alternative, the effect of polishing can be improved more clearly. In the paper, a new magnetic-electrochemical compound polishing tool is developed. The tool can be fixed on spindle of CNC easily. The tool is flexible, so it can make the polishing head and workpiece touch evenly each other. Because the head of magnetic-electrochemical compound polishing tool is a series, the head can be replaced conveniently according to different surface. Particularly, the tool can set a magnetic field whose direction is parallel to the electrical field’s direction. The tool can change strength of the magnetic field easily. At last, the tool is tested and its function is perfect.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

298-302

Citation:

Online since:

July 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] J.P. Huissoon and F. Ismail: The Inter. J. of Adv. Manufa. Tech. Vol. 19 (2002), pp: 285.

Google Scholar

[2] Swain and John: Design Engineering Vol. 9 (1999), pp: 47.

Google Scholar

[3] M.S. Li, Y.Q. Yu and E.L. Liu: Key Eng. Mater. Vol. 375 (2008), p.6.

Google Scholar

[4] Kim Jeong-Du, D.X. Jin and Choi Min-Seng: Inter. J. of Mach. Tools & Manuf. Vol. (1997).

Google Scholar

[5] Y.Q. Chen: J. l of Mater. Proc. Techno. Vol. 129 (2002), p.310.

Google Scholar

[6] M.S. Li, J.N. Yong, E.L. Liu and Y.F. Ma: Key Eng. Mater. Vol. 416 (2009), p.1.

Google Scholar

[7] L.M. Shi, E.L. Liu, Y.J. Niu and Y.Q. Chen: Adv. Eng. Mater. Vol. (2010).

Google Scholar

[8] E. -S. Lee: Adv. Manuf. Techno. Vol. 16 (2000), p.591.

Google Scholar

[9] H. Tam, Osm and C. Lui, A, C, MOK: J. of Mater. Proc. Techno. Vol. 95 (1999), p.191.

Google Scholar

[10] L.M. Shi, Y.Q. Chen and Q.M. Shi: J. of Harbin Uni. of Sci. and Techno. Vol. (2007).

Google Scholar