Fatigue Crack Closure Monitoring at Elevated Temperatures Using Laser Interferrometric Displacement Gage

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Periodical:

Key Engineering Materials (Volumes 51-52)

Edited by:

Kang Yong Lee and Hideaki Takahashi

Pages:

349-354

DOI:

10.4028/www.scientific.net/KEM.51-52.349

Citation:

K. Ogura and I. Nishikawa, "Fatigue Crack Closure Monitoring at Elevated Temperatures Using Laser Interferrometric Displacement Gage", Key Engineering Materials, Vols. 51-52, pp. 349-354, 1991

Online since:

January 1991

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$35.00

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