Adhesion of Silicon to the Tool during Diamond Cutting Silicon by Molecular Dynamics

Zhi Guo Wang; Yi Chun Liang; Jia Xuan Chen

doi:10.4028/www.scientific.net/KEM.522.197

Paper Titles

Numerical Simulation of Temperature Field for Laser Clad Composite Coatings
p.178

Microstructures and Properties of Ti Matrix Composite Coatings with Ex/In Situ TiC Reinforced
p.183

Study on the Multi-Axis Machining Technology of Helical Gear
p.187

Research on FDM Technique for the First Die of Matrix PDC Bit
p.192

Adhesion of Silicon to the Tool during Diamond Cutting Silicon by Molecular Dynamics
p.197

FEM Analysis of Temperature in High Speed Cutting of TiAl6V4 Alloys
p.201

Car's Internal Shield CNC Machining Technology and Analysis of Machine Tool Rack Mechanical
p.206

Physical Simulation of Cutting Process and Optimization of Cutting Parameters
p.210

The Effect of Boron-Sulphurizing Rare Earth on Microstructure and Properties of Boronized Layer
p.217

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Adhesion of Silicon to the Tool during Diamond Cutting Silicon by Molecular Dynamics

Abstract:

Wear of diamond tool is also very serious, which affects the surface quality of the machined work material, even if ductile mode where an undeformed chip thickness is at a nanoscale is used. During the cutting process, the crystal structure in the cutting zone is destroyed under the high pressures applied by the diamond tool. The silicon atoms adhering to the tool surface reconstruct to be in a crystal state under the effect of adhesion and pressures.