Development of a Cutting Tool with Micro Built-In Thermocouples - Characteristic of the Micro Cu/Ni Thermocouples Fabricated by Electroless Plating and Electro Plating
This study has devised a tool insert with micro built-in thermocouples in order to establish a cutting-temperature measuring method for practical use. This tool insert possesses seven pairs of micro Cu/Ni film thermocouple near the cutting edge on the rake face. In this study, Cu film and Ni film were deposited in the micro grooves corresponding to a circuit pattern of the micro thermocouple by means of electroless plating and electroplating. This paper shows the results of the investigation concerning the electrical properties of the micro Cu/Ni film thermocouples. The influence of the current density in electroplating on the electrical resistivity of the films was examined. The characteristic of the Seebeck property of the micro Cu/Ni film thermocouple was investigated in a temperature difference of up to 600 K with a heating apparatus developed. The Seebeck coefficient of the micro Cu/Ni film thermocouple was smaller by 28 % than that of a Cu/Ni wire thermocouple. The result implies that the degradation in the Seebeck property of the micro Cu/Ni film thermocouple derives from an existence of an impurity between Cu film and Ni film in the hot junction.
Tojiro Aoyama, Hideki Aoyama, Atsushi Matsubara, Hayato Yoshioka and Libo Zhou
J. Harashita et al., "Development of a Cutting Tool with Micro Built-In Thermocouples - Characteristic of the Micro Cu/Ni Thermocouples Fabricated by Electroless Plating and Electro Plating", Key Engineering Materials, Vols. 523-524, pp. 815-820, 2012