Development of a Cutting Tool with Micro Built-In Thermocouples - Characteristic of the Micro Cu/Ni Thermocouples Fabricated by Electroless Plating and Electro Plating

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This study has devised a tool insert with micro built-in thermocouples in order to establish a cutting-temperature measuring method for practical use. This tool insert possesses seven pairs of micro Cu/Ni film thermocouple near the cutting edge on the rake face. In this study, Cu film and Ni film were deposited in the micro grooves corresponding to a circuit pattern of the micro thermocouple by means of electroless plating and electroplating. This paper shows the results of the investigation concerning the electrical properties of the micro Cu/Ni film thermocouples. The influence of the current density in electroplating on the electrical resistivity of the films was examined. The characteristic of the Seebeck property of the micro Cu/Ni film thermocouple was investigated in a temperature difference of up to 600 K with a heating apparatus developed. The Seebeck coefficient of the micro Cu/Ni film thermocouple was smaller by 28 % than that of a Cu/Ni wire thermocouple. The result implies that the degradation in the Seebeck property of the micro Cu/Ni film thermocouple derives from an existence of an impurity between Cu film and Ni film in the hot junction.

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Periodical:

Key Engineering Materials (Volumes 523-524)

Edited by:

Tojiro Aoyama, Hideki Aoyama, Atsushi Matsubara, Hayato Yoshioka and Libo Zhou

Pages:

815-820

Citation:

J. Harashita et al., "Development of a Cutting Tool with Micro Built-In Thermocouples - Characteristic of the Micro Cu/Ni Thermocouples Fabricated by Electroless Plating and Electro Plating", Key Engineering Materials, Vols. 523-524, pp. 815-820, 2012

Online since:

November 2012

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$38.00

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