Development of a Cutting Tool with Micro Built-In Thermocouples - Characteristic of the Micro Cu/Ni Thermocouples Fabricated by Electroless Plating and Electro Plating

Abstract:

This study has devised a tool insert with micro built-in thermocouples in order to establish a cutting-temperature measuring method for practical use. This tool insert possesses seven pairs of micro Cu/Ni film thermocouple near the cutting edge on the rake face. In this study, Cu film and Ni film were deposited in the micro grooves corresponding to a circuit pattern of the micro thermocouple by means of electroless plating and electroplating. This paper shows the results of the investigation concerning the electrical properties of the micro Cu/Ni film thermocouples. The influence of the current density in electroplating on the electrical resistivity of the films was examined. The characteristic of the Seebeck property of the micro Cu/Ni film thermocouple was investigated in a temperature difference of up to 600 K with a heating apparatus developed. The Seebeck coefficient of the micro Cu/Ni film thermocouple was smaller by 28 % than that of a Cu/Ni wire thermocouple. The result implies that the degradation in the Seebeck property of the micro Cu/Ni film thermocouple derives from an existence of an impurity between Cu film and Ni film in the hot junction.

• Periodical: Key Engineering Materials (Volumes 523-524)
• Pages: 815-820
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.523-524.815
• Online since: November 2012
• Authors: Junichi Harashita, Yuji Tomoda, Jun Shinozuka
• Keywords: Cutting, Electrical Resistivity, Micro Thermocouple, Seebeck Coefficient, Temperature

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