Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

Shen Li Fu; Hsiang Chen Hsu; Yue Min Wan; Chi Hau Haung

doi:10.4028/www.scientific.net/KEM.573.1

Paper Titles

Preface

Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads
p.1

Surface Tension Measurement of Liquid Fe-Si-B Alloy by Sessile Drop Method
p.9

Conductivity Analysis on Hetero-Junction of Multiple Nano-Structural Layers
p.13

Ceramic Foam Filters in Runner System Design for Castings
p.19

Properties Investigation of Yb³⁺-Doped Phosphate Glasses for Fiber Laser
p.31

Spray-Formed 50Si-50Al Alloy Deformed in the Semi-Solid State
p.37

Effects of Cold-Spray Coatings on the Corrosion Properties of AZ80 Magnesium Alloy
p.43

Characteristics of Micro-Arc Treated Osseointegrated Porous Hydroxyapatite/Titanium Dioxide Coatings on Titanium Metal
p.49

HomeKey Engineering MaterialsKey Engineering Materials Vol. 573Reliability and Bondability Study on Interfacial...

Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads

Abstract:

In this paper, micro interfacial behavior for Sn3.5Ag0.5Cu (SAC305) lead-free solder on Cu-Ni-Au substrate has been carefully investigated. It is observed that the intermetallic compound (IMC) ingredients along the SAC305 solder on the Cu-Ni-Ag substrate are (Ni, Cu)₃Sn₄ and (Cu, Ni)₆Sn₅ after reflow process. Reliability analysis for IMC ((Ni, Cu)₃Sn₄and (Cu, Ni)₆Sn₅) was conducted based on the measurement of IMCs thickness and ball shear force. Temperature effects were also included in the analysis. The ingredients of IMC remain un-change if the working temperature is below 400 ^OC. Diffusion rate of interfacial controlled reaction was found to be depended on the annealing temperature. The IMC layer thickness decreased as the ramp-up rate of reflow temperature was increased for all cases studies. Preliminary results demonstrated that the measured ball shear force slightly changed for all different IMC thicknesses.

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Key Engineering Materials (Volume 573)

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1-7

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https://doi.org/10.4028/www.scientific.net/KEM.573.1

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September 2013

Authors:

Shen Li Fu, Hsiang Chen Hsu, Yue Min Wan, Chi Hau Haung

Keywords:

(Cu, Ni)₆Sn₅, (Ni, Cu)₃Sn₄, Intermetallic Compound (IMC), Organic Solderability Preservative (OSP), Sn3.5Ag0.5Cu (SAC305)

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