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Surface Damage and Fatigue Strength of Ultrafine Grained Copper Treated by Mild Annealing

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Abstract:

Fatigue tests of ultrafine grained (UFG) copper produced by equal channel angular pressing (ECAP) showed negligible enhancement of fatigue strength in high-cycle fatigue regime. This was attributed to the thermal instability of UFG microstructure; a grain coarsening occurred during a large number of stress repetitions. Aiming at an enhancement of fatigue strength in the long-life field in excess of 107 cycles, post-ECAP mild-annealing for improving thermal stability was conducted. Grains with sizes up to a few tens of micrometers surrounded by fine grains were formed after the annealing as a result of discontinuous recrystallization. The improved stability of post-ECAP annealed micrstrucvture was related to the 9% increased fatigue strength in long life fields. The effect of bimodal microstructure on surface damage formation and fatigue strength was discussed.

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Periodical:

Key Engineering Materials (Volumes 577-578)

Pages:

145-148

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.577-578.145

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Online since:

September 2013

Authors:

N. Teshima, Masahiro Goto, S.Z. Han, Kwang Jun Euh, K. Yamauchi, Norio Kawagoishi

Keywords:

Copper, ECAP, Fatigue, Mild Annealing, Surface Damage, Ultrafine Grain

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