Material Removal Rate Control in Open-Air Type Plasma Chemical Vaporization Machining by Pulse Width Modulation of Applied Power

Yoshiki Takeda; Yuki Hata; Katsuyoshi Endo; Kazuya Yamamura

doi:10.4028/www.scientific.net/KEM.625.593

Paper Titles

Figuring and Finishing of Reaction-Sintered SiC by Anodic Oxidation Assisted Process
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Improvement of Accuracy in Micro-EDM of Tungsten Carbide Using Deionized Water
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Influence of Ultrasonic Assisted Processing on the Ductility of Binderless Tungsten Carbide
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Material Removal Rate Control in Open-Air Type Plasma Chemical Vaporization Machining by Pulse Width Modulation of Applied Power
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Surface Characteristics Produced by Multi-Wire Sawing of GFRP
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Ultrasonic Elliptical Vibration-Assisted Micro-Groove Turning
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 625Material Removal Rate Control in Open-Air Type...

Material Removal Rate Control in Open-Air Type Plasma Chemical Vaporization Machining by Pulse Width Modulation of Applied Power

Abstract:

Plasma chemical vaporization machining (PCVM) is an ultraprecise figuring technique for optical components without introducing the subsurface damage. In our previous study, the material removal volume was controlled by changing the scanning speed of the worktable. However, because of inertia of the worktable, a discrepancy between the theoretical scanning speed and the actual scanning speed will occur if the spatial change rate of speed is rapid. Therefore, we proposed the application of the pulse width modulation (PWM) control and the amplitude modulation (AM) control of the applied RF power to control the material removal rate (MRR). Experimental results showed that the relationship between the MRR and the average RF power had high linearity, the control range of the PWM control mode was from 0.19 x 10^-2mm³/min to 3.90 x 10^-2mm³/min (from 5% to 100%), which was much wider than that of the AM control mode.

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Periodical:

Key Engineering Materials (Volume 625)

Pages:

593-596

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.625.593

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Online since:

August 2014

Authors:

Yoshiki Takeda, Yuki Hata, Katsuyoshi Endo, Kazuya Yamamura*

Keywords:

Atmospheric Pressure Plasma, Plasma Etching, Pulse Width Modulation, Ultraprecision Figuring

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