Embossing of Metal Inserts for Subsequent Assembly Injection Moulding of Media Tight Electronic Systems

Abstract:

Due to the increasing number of electronics in several industrial sectors, especially in the automotive industry, there is a rising demand for flexible and adaptable electronic systems with high functional density and resilience. An efficient method for producing such parts is the encapsulation of metal inserts, for example lead frames, by means of assembly injection moulding. Often such parts are exposed to water and moist at the place of action. Thus, one major challenge is to provide electronics with enduring media tightness in a severe environment. The research work covered in this paper focuses on embossing surface structures in metal inserts for subsequent assembly injection moulding. The influence of geometrical parameters of the embossed profile on both the material flow and the accuracy of the created structure are investigated. For this purpose experimental as well as numerical results are presented. Furthermore, the performance of embossed inserts in subsequent assembly injection moulding is analysed.

• Periodical: Key Engineering Materials (Volume 639)
• Pages: 99-106
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.639.99
• Online since: March 2015
• Authors: Philipp Frey, Martina Heinle, Christoph Leisen, Dietmar Drummer, Marion Merklein
• Keywords: Metal Forming, Microforming, Moulding

References

[1] R. Chitkara, W. Ballhaus, B. Kliem, S. Berings, B. Weiss, Spotlight on Automotive - PwC Semiconductor Report, (2013).

[2] G. Gotzmann, Werkstoffe mit Multifunktionen, Kunststoffe 92 (2002) 6, p.97–108.

[3] G. W. Ehrenstein, Handbuch Kunststoff-Verbindungstechnik, first ed., Hanser, München, (2004).

[4] C. Heinle, M. Vetter, Z. Brocka-Krzeminska, G. W. Ehrenstein, D. Drummer, Tight Material Bonds within Mechatronic Systems by Assembly Moulding, J. Plast. Technol. 5 (2009) 6, p.428–450.

[5] G. W. Ehrenstein, Mediendichte elektrische Durchleitungen im Spritzgießverfahren, in: J. Song (Eds. ), Proc. 2. Symposium Connectors, 2009, p.51–61.

[6] T. Fellner; J. Wilde, Beständige, dichte Metall-Kunststoff-Verbindungen an Premolded Gehäusen, (2008).

[7] M. Geiger, M. Kleiner, R. Eckstein, N. Tiesler, U. Engel, Microforming, Annals of the CIRP 50 (2001) 2, p.445–462.

DOI: 10.1016/s0007-8506(07)62991-6

[8] H. Ike, Surface deformation vs. bulk plastic deformation—a key for microscopic control of surfaces in metal forming, J. Mater. Process. Technol. 138 (2003) 1-3, p.250–255.

DOI: 10.1016/s0924-0136(03)00080-3

[9] M. Thome, G. Hirt, B. Rattay, Metal Flow and Die Filling in Coining of Micro Structures with and without Flash, Adv. Mater. Res. (2005) 6-8, p.631–638.

[10] T. Stellin, R. van Tijum, M. Merklein, U. Engel, Study of Microforging of Parallel Ribs from Metal Strip, KEM (2014) 611-612, p.565–572.

DOI: 10.4028/www.scientific.net/kem.611-612.565

[11] J. Böhm, A. Schubert, T. Otto, T. Burkhardt, Micro-metalforming with silicon dies, Microsystem Technologies 7 (2001) 4, p.191–195.

DOI: 10.1007/s005420000084

[12] J. Mai, L. Peng, X. Lai, Z. Lin, Electrical-assisted embossing process for fabrication of micro-channels on 316L stainless steel plate, J. Mater. Process. Technol. 213 (2013) 2, p.314–321.

DOI: 10.1016/j.jmatprotec.2012.09.013

[13] Information on https: /www. kupferinstitut. de/fileadmin/user_upload/kupferinstitut. de/de/Documents/Shop/Verlag/Downloads/Werkstoffe/brosch20. pdf [06. 10. 2014].

[14] F. Ostermann, Anwendungstechnologie Aluminium, second ed., Springer, Berlin, (2007).

[15] M. Thome, Umformtechnische Herstellung funktionaler flächiger Mikrostrukturen in metallischen Werkstoffen, in: Hirt, G.; Raabe, D.; Kopp, R. (Eds. ), Umformtechnische Schriften, Vol. 150, Shaker, Aachen, (2009).