Feasibility Study of Micro-Hole Wall Grinding by Micro-Elastic Abrasive Particles

Feng Che Tsai; Shie Chen Yang; Tsuo Fei Mao; Hsi Chuan Huang; Tsung Lun Li

doi:10.4028/www.scientific.net/KEM.642.207

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 642Feasibility Study of Micro-Hole Wall Grinding by...

Feasibility Study of Micro-Hole Wall Grinding by Micro-Elastic Abrasive Particles

Abstract:

This study aims to develop a polishing process improvement technology for deep micro-hole knockout hole wall with high aspect ratio, and discuss the optimal polishing parameter combination of abrasive jet machining method and micro-elastic abrasive particles for deep micro-hole knockout hole wall surface. A micro-elastic abrasive process technology was thus developed. The experimental results showed that the micro-elastic abrasive has better grinding effect on the surface roughness of knockout hole wall in length of 300 mm and in inside diameter of ψ2mm in the machining conditions of jet pressure 0.5MPa, volume mixing ratio 2:1 of abrasive particles to additive and vacuum attraction 70 cmHg. It was improved from 2.39 μm Ra (10.74 μm Rmax) to 0.08 μmRa (1.12 μm Rmax), proving the feasibility of micro-elastic abrasive. The surface was improved well, and the process time was shortened greatly.

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Periodical:

Key Engineering Materials (Volume 642)

Pages:

207-211

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.642.207

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Online since:

April 2015

Authors:

Feng Che Tsai*, Shie Chen Yang, Tsuo Fei Mao, Hsi Chuan Huang, Tsung Lun Li

Keywords:

Ejector Pin, High Aspect Ratio, Surface Treatment Technology

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References

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