Study on Influence Laws of Surface Roughness of Micro-Groove in Single Crystal Silicon under Diamond Fly-Cutting

Abstract:

Single crystal silicon has both important application value in the fields of micro-optics and MEMS, and it has been considered as one of the most difficult-to-cut materials because of its hardness and brittleness. Removal mechanism of the silicon was discussed, and the model of undeformed chip thickness was established in this article. According to the data of micro-groove surface roughness from the diamond fly-cutting experiment, the nonlinear relationship curve, between the largest undeformed chip thickness h_max and microgroove surface roughness R_a, were obtained using Gaussian-fitting principle, and the regression equation of the fitting curve was also got. Thus the prediction mathematical model of microgroove surface roughness was derived. The influence laws of the main working parameters on the R_a were obtained based on the result of this experiment and the response surface of the prediction model, and some conclusions were summarized: the surface roughness R_a of microgroove in the single crystal silicon decreases with the decrease of the cutting depth a_p, the feed f and the increase of the spindle speed n under the diamond fly-cutting; the experimental results also showed that feed f affects the value of R_a very much, cutting depth a_p less, and spindle speed n the least.

• Periodical: Key Engineering Materials (Volume 667)
• Pages: 142-148
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.667.142
• Online since: October 2015
• Authors: Yan Yan Yan, Run Xing Wang, Bo Zhao
• Keywords: Diamond Fly-Cutting, Prediction Model, Single Crystal Silicon, Surface Roughness, Undeformed Chip Thickness

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