Temperature Distribution on the Surface of LED Lamps

Abstract:

In this work, new thermally conductive polymer materials (TCPMs) on the base of polymer/graphite composites for cooling system of LED lamps were developed. Heat sinks for LED lamps were fabricated and investigated. Thermal conductivity and thermal diffusivity for all TCPMs were investigated by thermal analyzers XFA 500 and THB 100. Infrared thermal imager was used to study the temperature distribution of the LED lamps. Experimental and numerical investigations have shown high efficiency of polymer/graphite heat sinks for LED lamps.

• Periodical: Key Engineering Materials (Volume 712)
• Pages: 351-356
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.712.351
• Online since: September 2016
• Authors: Sergey M. Lebedev*, Sergey Yu. Gurin
• Keywords: Heat Transfer, LED Lamp, Polymer Heat Sink, Thermal Conductivity, Thermal Diffusivity

References

[1] X. Luo, S. Liu, A microjet array cooling system for thermal management of high-brightness LEDs, Adv. Packag. IEEE Trans. 30 (2007) 475–484.

DOI: 10.1109/tadvp.2007.898522

[2] X. Luo, W. Chen, R. Sun, S. Liu, Experimental and numerical investigation of a microjet-based cooling system for high power LEDs, Heat. Transf. Eng. 29 (2008) 774–781.

DOI: 10.1080/01457630802053777

[3] Y. Deng, J. Liu, A liquid metal cooling system for the thermal management of high power LEDs, Int. Commun. Heat. Mass Transf. 37 (2010) 788–791.

DOI: 10.1016/j.icheatmasstransfer.2010.04.011

[4] L. Kim, J.H. Choi, S.H. Jang, M.W. Shin, Thermal analysis of LED array system with heat pipe, Thermochim. Acta 455 (2007) 21–25.

DOI: 10.1016/j.tca.2006.11.031

[5] X. -Y. Lu, T. -C. Hua, Y. -P. Wang, Thermal analysis of high power LED package with heat pipe heat sink, Microelectron. J. 42 (2011) 1257–1262.

DOI: 10.1016/j.mejo.2011.08.009

[6] Y. Tang, X. Ding, B. Yu, Z. Li, B. Liu, A high power LED device with chips directly mounted on heat pipes, Appl. Therm. Eng. 66 (2014) 632–639.

DOI: 10.1016/j.applthermaleng.2014.02.067

[7] www. coolpolymers. com/heattrans. html.

[8] J.L. Zeng, Z. Cao, D.W. Yang, L.X. Sun, L. Zhang, Thermal conductivity enhancement of Ag nanowires on an organic phase change material, J. Therm. Analysis Calorim. 101 (2010) 385–389.

DOI: 10.1007/s10973-009-0472-y

[9] S.H. Song, K.H. Park, B.H. Kim, Y.W. Choi, G.H. Jun, D.J. Lee, B.S. Kong, K.W. Paik, S. Jeon, Enhanced thermal conductivity of epoxy-graphene composites by using non-oxidized graphene flakes with non-covalent functionalization, Adv. Mater. 25 (2013).

DOI: 10.1002/adma.201202736

[10] J. Han, A. Fina, Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review, Prog. Polym. Sci. 36 (2011) 914–944.

DOI: 10.1016/j.progpolymsci.2010.11.004

[11] Y. -X. Fu, Z. -X. He, D. -C. Mo, S. -S. Lu, Thermal conductivity enhancement with different fillers for epoxy resin adhesives, Appl. Therm. Eng. 66 (2014) 493–498.

DOI: 10.1016/j.applthermaleng.2014.02.044

[12] S.M. Lebedev, O.S. Gefle, S.N. Dneprovskii, E.T. Amitov, Thermophysical properties of polymeric materials with high thermal conductivity, Russian Physics Journal, 58 (2015) 266–270.

DOI: 10.1007/s11182-015-0491-z

[13] G.C. Glatzmaier and W. F. Ramirez, Simultaneous measurement of the thermal conductivity and thermal diffusivity of unconsolidated materials by the transient hot wire method, Rev. Sci. Instrum. 56 (1985) 1394–1398.

DOI: 10.1063/1.1138491

[14] W.J. Parker, R.J. Jenkins, C.P. Butler, and G.L. Abbott, A flash method of determining thermal diffusivity, heat capacity, and thermal conductivity, J. Appl. Phys. 32 (1961) 1679–1684.

DOI: 10.1063/1.1728417