High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride

Abstract:

Article Preview

Info:

Periodical:

Key Engineering Materials (Volumes 89-91)

Main Theme:

Edited by:

Michael J. Hoffmann, Paul F. Becher and Günther Petzow

Pages:

633-634

DOI:

10.4028/www.scientific.net/KEM.89-91.633

Citation:

A.A. Postnikov and V.G. Verjovka, "High-Temperature Creep Deformation of Hot-Pressed Silicon Nitride", Key Engineering Materials, Vols. 89-91, pp. 633-634, 1994

Online since:

August 1993

Export:

Price:

$35.00

In order to see related information, you need to Login.