Nanofluid Heat Transfer Coefficient Enhancement Using Connectors

Abstract:

The requirement for effective cooling of modern electrical and mechanical components has increased due to the desire for more compact and efficient designs. Thermal systems have used working fluids as a method for cooling systems for many years. However, technological improvements have dictated that working fluids must be more efficient for their applications. Researchers presented nanofluids as a possible solution for this issue, and they have gained a lot of attention due to their capability to enhance the heat transfer coefficient in miniaturized cooling or heating systems. The main purpose of this paper is to enhance the heat transfer coefficient in micro scales by encouraging the random motion of the particles in the nanofluid. This is accomplished by placing a nozzle between two micro-channels. The random motion of the particles is enhanced within the nozzle, increasing the heat transfer coefficient in the microchannel downstream as a result. In addition, the effects of characteristics of nanofluid are discussed briefly.

• Periodical: Key Engineering Materials (Volume 971)
• Pages: 145-150
• DOI: https://doi.org/10.4028/p-jXK3mV
• Online since: December 2023
• Authors: Gabriel Herrera, Zach Hamel, Jake Wohld, Michael Palmer, Saeid Vafaei*, Cristian Gaytan
• Keywords: Heat Transfer Coefficient, Microchannel, Nanofluid, Nozzle Connector

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