Tool Geometry Effect in Friction Stir Extrusion of Seamless Tubes from Aluminium Chips

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Abstract:

Nowadays, the growing demand for sustainable solutions in manufacturing has shifted research attention toward innovative recycling strategies. Among these, the Solid-State Recycling (SSR) technique has emerged as a viable approach to transform metal swarf into new products. Within the SSR family, friction stir extrusion (FSE) has gained particular interest as a promising method for producing wires from metal scraps, but recently, it was also employed for tube manufacturing. In literature, tube production via chip recycling often involves multi-step approaches, first consolidating/homogenizing the recycled chips and then extruding. In other cases, the tubes are manufactured directly from a bulk material, losing the sustainable goal. For this reason, this study aims to propose a single-step process in which aluminium chips are directly turned into a consolidated tube without any intermediate step. In addition, specific attention was given to the study of tool geometry, aiming to investigate the effect of a tapered tool’s shape on the material flow and the overall process performance. Experimental tests were conducted to characterize the microstructure of extruded tubes and to calibrate numerical simulations employed for investigating process dynamics. Results revealed that the reduced contact diameter of the chamfered tool generated lower processing temperatures but higher strain levels, fundamentally shifting the bonding mechanism from thermal assistance to mechanical dominance in oxide film breakage. Microstructural analysis demonstrated that the flat tool, characterized by predominant frictional heating and lower deformation, produced larger grain diameters due to thermally induced coarsening. Conversely, the chamfered tool yielded significantly refined grain structures through severe plastic deformation and dynamic recrystallization under suppressed thermal conditions, indicating superior consolidation quality and enhanced particle bonding.

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Periodical:

Materials Science Forum (Volume 1185)

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89-97

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April 2026

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