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HomeMaterials Science ForumMaterials Science Forum Vols. 119-121Ultrasonic Attenuation and Modulus Defect...

Ultrasonic Attenuation and Modulus Defect Associated with the Bordoni Peak in Copper Single Crystals

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Internal Friction and Ultrasonic Attenuation in Solids

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Periodical:

Materials Science Forum (Volumes 119-121)

Pages:

189-194

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.119-121.189

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Online since:

January 1993

Authors:

A.O. Moreno Gobbi, José Antônio Eiras

Keywords:

Bordoni Peak, Copper (Cu), Plastic Deformation, Ultrasonic Attenuation

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© 1993 Trans Tech Publications Ltd. All Rights Reserved

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