Diffusion Induced Grain Boundary Migration and Recrystallization in the Ni3Al(Cu) System

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Periodical:

Materials Science Forum (Volumes 126-128)

Edited by:

Ph. Komninou and A. Rocher

Pages:

317-320

DOI:

10.4028/www.scientific.net/MSF.126-128.317

Citation:

C. Y. Ma et al., "Diffusion Induced Grain Boundary Migration and Recrystallization in the Ni3Al(Cu) System", Materials Science Forum, Vols. 126-128, pp. 317-320, 1993

Online since:

January 1993

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$35.00

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